company news about Ice9 TPU Advances 3D Printing for Thermal Management

Imagine your 3D-printed creations evolving from mere decorative models into high-performance electronic components capable of efficient heat dissipation, or even serving as core elements in liquid cooling systems. This vision has now materialized through Tcpoly's groundbreaking innovation: Ice9 TPU, a material that seamlessly merges thermal conductivity with flexibility to revolutionize electronic cooling solutions.

Ice9 TPU represents a significant leap forward in fused deposition modeling (FDM) materials. This thermally conductive, semi-flexible thermoplastic polyurethane filament boasts an exceptional thermal conductivity of 6 W/m-K along the printing direction—far surpassing conventional TPU materials. This property enables printed components to efficiently transfer heat away from sensitive electronic elements, enhancing device performance and reliability.

Traditional 3D printing polymers typically exhibit poor thermal conductivity, limiting their application in thermal management. Ice9 TPU shatters this limitation with its 6 W/m-K in-plane conductivity, making it ideal for manufacturing heat sinks, liquid cooling components, and other thermal management applications. The material's 2 W/m-K through-plane conductivity ensures comprehensive heat dissipation across all dimensions.

Beyond its thermal properties, Ice9 TPU maintains excellent flexibility and durability. With a Shore hardness of 88A, it strikes a perfect balance between rigid plastics and soft rubbers. This intermediate hardness allows for bending and deformation without compromising structural integrity. The material withstands continuous operation at temperatures up to 110°C, meeting demanding industrial requirements.

To maximize Ice9 TPU's performance, Tcpoly recommends the following printing configurations:

• Nozzle temperature: 230-270°C
• Build plate temperature: 0-50°C
• Cooling fan: 60% (bridging only)

• Print speed: 20-125 mm/s
• Layer height: 0.2-0.7 mm
• Retraction distance: 6 mm
• Extra restart distance: 0.5 mm
• Optimal infill density for thermal performance: 95-100%

• Nozzle diameter: 0.4-1.0 mm
• Extruder type: Direct-drive dual-gear extruder (1.75 mm) strongly recommended
• Build surface preparation: Masking tape with adhesive for unheated beds; PEI spring steel sheet for heated beds
• Drying requirements: 4 hours at 90°C
• Storage: Keep in sealed bags

Ice9 TPU unlocks new possibilities for 3D printing in thermal management applications, including:

• Heat sinks for electronics and LED lighting
• Liquid cooling system components
• Power supply and motor cooling solutions
• Thermally conductive sensor and battery enclosures
• Wearable device cooling components

A gaming laptop manufacturer successfully implemented Ice9 TPU to overcome thermal limitations in their high-performance design. By printing liquid cooling system components—including water blocks and tubing—the company achieved superior heat transfer from CPUs and GPUs to coolant, significantly reducing chip temperatures while benefiting from the material's flexibility for easier system integration.

• Exceptional thermal conductivity for efficient heat transfer
• Optimal balance of flexibility and durability
• High-temperature stability for demanding environments
• Compatibility with standard FDM printers
• Broad application potential across industries

Ice9 TPU marks a significant advancement in functional 3D printing materials, particularly for thermal management applications. As additive manufacturing continues to evolve alongside specialized material development, innovative cooling solutions will play an increasingly vital role in enhancing electronic device performance and reliability.